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Version 1.2 , May 2004
Datasheet
DS-CoreControl-TDA21302
TDA21302
Authors: Edward Chang
Published by Infineon Technologies AG http://www.infineon.com/DCDC
Power Management & Supply
N e v e r s t o p t h i n k i n g.
CoreControl TM
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DS-CoreControl-TDA21302
Contents:
Features...........................................................................................................................3 Application........................................................................................................................3 Pinout Drawing and Description............................................................................................3 General Description............................................................................................................5 Block Diagram...................................................................................................................5 Reference Schematic.........................................................................................................6 Absolute Maximum Rating .................................................................................................................... 7 Thermal Characteristic.......................................................................................................................... 7 Electrical Characteristic ........................................................................................................................ 7 Operating Condition.............................................................................................................................. 9 VRD10,x VID Table ............................................................................................................................ 10 Application Information ....................................................................................................................... 11 Voltage Control.....................................................................................................11 Current Balance....................................................................................................12 Load Droop..........................................................................................................12 Fault Detection......................................................................................................12 Phase Setting and Converter Start Up........................................................................13 Current Sensing Setting..........................................................................................13 DAC Offset Voltage & Droop Tuning..........................................................................14 Protection and SS Function.....................................................................................15 Design Procedure Suggestion ............................................................................................................ 16 Design Example.................................................................................................................................. 17 Layout Guide ...................................................................................................................................... 20 Outline Diemension...........................................................................................................22
CoreControl TM
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DS-CoreControl-TDA21302
Multi-Phase PWM Controller for CPU Core Power Supply
P-DSO-32
Features :
* * * * * * * * Multi-Phase PWM Conversion with Automatically Phase Selection VRD10.X Compliant Active Droop Compensation For Fast Load Response Smooth VCORE Voltage Transition during the VID On The Fly Power Stage Thermal Balance By Sync FET Rds(on) Current Sense Technique Hiccup Mode Over Current Protection Programmable Switching Frequency ( 50KHz ~ 400KHz per Phase ), Under Voltage Lockout, and Soft-Start High Output Ripple Frequency times numbers of working Channels
Application :
* * * Intel Processor Voltage Regulator : VRM10.X Low Output Voltage High Output Current DC-DC Converters Voltage Regulator Modules Type TDA21302 Package P-DSO-32 Marking 21302 Ordering Code Q67042-S4229
Pinout Drawing and Description :
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DS-CoreControl-TDA21302
CoreControl TM
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DS-CoreControl-TDA21302
Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Name
OVP PGOOD VID4 VID3 VID2 VID1 VID0 VID125 VOSS ADJ SS FB COMP VDIF ISN4 ISN3 ISN2 ISN1 VSEN SGND GND PWM3 ISP3 ISP1 PWM1 PWM2 ISP2 ISP4 PWM4 VCC DVD RT
Over voltage trip output
Description
Open drain power good signal output pin Voltage Identification DAC Input. Internally pull up to 3V. Voltage Identification DAC Input. Internally pull up to 3V. Voltage Identification DAC Input. Internally pull up to 3V. Voltage Identification DAC Input. Internally pull up to 3V. Voltage Identification DAC Input. Internally pull up to 3V. Voltage Identification DAC Input. Internally pull up to 3V. Connect a resistor to GND to set the initial offset voltage. Connect a resistor to GND to set the Droop Voltage. Soft-Start. Connect with a capacitor to GND to set the Soft-Start Interval. Pulling down this pin below 1V shall shut the converter down. Internal error amplifier inverting input pin Output of the error amplifier and input of the PWM comparator Output pin of the differential converter output voltage sense Differential current sense negative input pin connects to the drain pin of channel 4 Sync FET Differential current sense negative input pin connects to the drain pin of channel 3 Sync FET Differential current sense positive input pin connects to the drain pin of channel 2 Sync FET Differential current sense positive input pin connects to the drain pin of channel 1 Sync FET The positive input pin of the differential converter output voltage sense amplifier The negative input pin of the differential converter output voltage sense amplifier Ground pin of the IC Channel 3 PWM output pin. Connect to high level for 2 phase operation. Differential current sense positive input pin connects to the source pin of channel 3 Sync FET Differential current sense positive input pin connects to the source pin of channel 1 Sync FET Channel 1 PWM output pin Channel 2 PWM output pin Differential current sense positive input pin connects to the source pin of channel 2 Sync FET Differential current sense positive input pin connects to the source pin of channel 4 Sync FET Channel 4 PWM output pin. Connect to high level for 2 or 3 phase operation. IC power supply pin connects to 5V Connect the external voltage divider to program the controller under voltage lockout based on the input voltage of the power stage voltage Connect a resistor to GND to set the channel switching frequency
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DS-CoreControl-TDA21302
General Description
TDA21302 is a multi-phase DC-DC buck converter controller integrated all control functions for the next generation GHz CPU voltage regulator. TDA21302 automatically controls 2 to 4 interleaved buck switching power stage operation. The multi-phase architecture is able to provide high output current with lower power dissipation on the switching devices and minimizing the input ripple current and output ripple voltage. The equivalent high operation frequency optimizes the voltage regulator design for better transient response and thermal performance. TDA21302 utilizes the Sync FET Rds(on) in every channel as the current sense element. The differential current sense in every channel results precious channel current information to the controller for good droop adjustment, channel current balance, channel switching devices thermal balance and over current protection.
Block Diagram
PGOOD VCC OVP DVD Power On VID0 VID1 VID2 VID3 VID4 Reset VID DAC & Step Control PG Setting OVP Setting RT Oscillatior & Sawtooth INH INH
+ + + + + + +
I
PWM Logic PWM CMP INH PWM Logic PWM CMP INH PWM Logic PWM CMP INH PWM Logic PWM CMP
PWM1
+
I
+
I
PWM2
+
I OCP
+
I
PWM3
Offset VOSS Setting
+
I
Setting
+ + +
Current Correction I
PWM4
+
I SGND I VSEN
+
I
ISN1 ISP1 ISN2 ISP2 ISN3 ISP3 ISN4 ISP4
+
I
+
I
+
I
+
+
I Soft Start VDIF FB COMP SS ADJ
+
I
+
I
+
SUM/M I
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Reference Schmatic
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Absolute Maximum Ratings
At Tj = 25 C, unless otherwise specified
Value Parameter Voltage supplied to `VCC' pin; DC Input, Output or I/O Pin Junction temperature Storage temperature ESD Rating; Human Body Model ESD Rating; Machine M Model IEC climatic category; DIN EN 60068-1 TJ TS Symbol VCC Min. -0.3 -0.3 0 -65 2 200 55/150/56 Max. 7 Vcc+0.3 125 150 KV V V C Unit
Thermal Characteristic
Values Parameter Thermal resistance, junction-soldering point Thermal resistance, junction-ambient 50 Symbol Min. Typ. Max. Unit K/W
Electrical Characteristic
At Vcc=5V, Tj = 25 C, unless otherwise specified
Values Parameter Supply Characteristic Bias supply current
POR Threshold
Symbol ICC VCCRTH VCCHYS VDVDTP VDVDHYS
Conditions PWM1,2,3,4 Open VCC rising threshold Low to High Enable VVCC falling threshold
Min. Typ. Max. Unit 12 4,0 0,2 1,9 4,2 0,5 2 0,1 2,1 16 4,5 mA V
Power On Reset Characteristic Hysteresis VDVD Threshold VDVD Hysteresis Oscillator
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Oscillator Frequency Accuracy Oscillator Frequency Adjustable Range Ramp Amplitude Ramp Valley Maximum Duty Cycle RT Pin Voltage Reference and DAC
fOSC fOSC_ADJ VOSC VRV
RRT = 12 K
170 50
200
230 400
KHz
RRT = 12 K 0,7 Every Phase 62 0,55 -1 -10 RRT = 12 K VDAC 1V
1,9 1,0 66 0,6 75 0,65 +1 +10 0,4 0,8 60 120 1,0 85 180 1,05
V V % V % mV V V uV V dB MHz V/uS K MHz V/uS uA
VRT
DACOUT Voltage Accuracy DAC (VID0~VID125) Input Low DAC (VID0~VID125) Input High DAC ( VID0~VID125) Bias Current VOSS Pin Voltage Error Amplifier Open Loop Gain Gain Bandwidth Slew Rate Input Impedance Gain Bandwidth Slew Rate ISP1, 2, 3, 4 Full Scale Source Current ISP1, 2, 3, 4 Current for OCP
VDAC VDAC < 1V RRT = 12 K VRV IBIAS_DAC VVOSS RVOSS = 100 K
0,95
GBW SR ZIMP GBW SR IISPFSS IISPOCP COMP = 10 pF 60 COMP = 10 pF
10 3 16 10 3
Differential Sense Amplifier
Differential Current Sense GM Amplifier
100
uA
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At Vcc=5V, Tj = 25 C, unless otherwise specified
Protection SS Current Over Voltage Trip ( VSENSE / DACOUT ) OVP Voltage Power Good Power Good Rising Threshold ( VSENSE / DACOUT ) Power Good Low Voltage VPGL IPG = 4mA 0,2 V VPG VSENSE Rising 92 % VOVT VOVP IOVP = 10mA 130 2,2 140 3,28 150 4,0 % V Iss Vss = 1V 8 13 18 uA
Operating Conditions
At Tj = 25 C, unless otherwise specified
Values Parameter Voltage supplied to `VCC' pins Ambient temperature Junction temperature TA TJ 0 0 70 125 C C Symbol VVCC Conditions Min. Typ. Max. Unit 4,5 5,0 5,5 V
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VRD10,X VID Table
Pin Names VID125 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 VID3 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 VID2 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 VID1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 VID0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 Vcore 0,8375 0,8500 0,8625 0,8750 0,8875 0,9000 0,9125 0,9250 0,9375 0,9500 0,9625 0,9750 0,9875 1,0000 1,0125 1,0250 1,0375 1,0500 1,0625 1,0750 1,0875 OFF OFF 1,1000 1,1125 1,1250 1,1375 1,1500 1,1625 1,1750 1,1875 1,2000 VID125 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VID4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 Pin Names VID3 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 VID2 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 VID1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 VID0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 Vcore 1,2125 1,2250 1,2375 1,2500 1,2625 1,2750 1,2875 1,3000 1,3125 1,3250 1,3375 1,3500 1,3625 1,3750 1,3875 1,4000 1,4125 1,4250 1,4375 1,4500 1,4625 1,4750 1,4875 1,5000 1,5125 1,5250 1,5375 1,5500 1,5625 1,5750 1,5875 1,6000
Note : " 1 " is open and " 0 " is connecting to ground.
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DS-CoreControl-TDA21302
Application Information :
TDA21302 is a multi-phase DC/DC controller that precisely regulates CPU core voltage and balances the current of different power channels. The converter consisting of TDA21302 and its companion drivers, TDA21106 and TDA21102, provides high quality CPU power and all the protection functions to meet the requirement of the latest VRMs. Voltage Control The TDA21302 senses the CPU VCORE by an precise instrumental amplifier to minimize the voltage drop on the PCB trace at heavy load condition. VSEN & SGND are the differential input pins for VCORE and their output, VDIF, is the input of the PGOOD & OVP sense. The internal highly accurate VID DAC provides the reference voltage for VRD10,X compliance. Control loop consists of error amplifier, pulse width modulator, external driver ICs and power components. Like conventional voltage mode controller, the output voltage is locked at the VREF of the error amplifier and the error signal is used as the control signal Vc of the pulse width modulator. The PWM signals of different channels are generated by comparison of EA output and split-phase saw-tooth wave. Power stage transforms VIN to output by PWM signal on-time ratio. PGOOD VCC OVP
Power On
DVD
VID0 VID1 VID2 VID3 VID4 VID125
Reset
VID DAC & Step
OVP Setting
+
I I
INH
PG Setting Offset
+
VOSS
Setting
+
I
PWM Comparator
SGND VSEN
+
I
+
I
Soft Start
VDIF
FB
COMP
SS
ADJ
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DS-CoreControl-TDA21302
Current Balance TDA21302 senses the current of the Sync FET in each phase when it is conducting for channel balance and droop tuning. The differential sensing GM amplifier converts the voltage on the sense components which can be sense resistors or the Rds(on) of the Sync FET to current signal into internal balance circuit. The current balance circuit sums and averages the current signals and then generates the balancing signals injected to pulse signal modulator. If some of the channel current is higher than average, the balancing signal shall decrease the pulse width to keep the current balance.
RT
Oscillatior & Sawtooth
INH
+ + + + + + + +
+
I
PWM Logic PWM CMP INH PWM Logic PWM CMP INH PWM Logic PWM CMP INH PWM Logic PWM CMP
PWM1
+
I
PWM2
+
I
PWM3
+
I
PWM4
COMP
Current Correction
+
I
ISN1 ISP1 ISN2 ISP2 ISN3 ISP3 ISN4 ISP4
+
I
+
I
+
SUM/M
I
Load Droop The sensed channel current signals regulated the reference of DAC to form a output voltage droop proportional to the load current. The droop or so-called " Active Voltage Positioning " can reduce the output voltage ripple during the load transient and the size of the LC filters. Fault Detection The chip detects VCORE for over voltage and power good detection. The " hiccup mode " operation of over-current protection is adopted to reduce the short circuit current. The inrush current at the start up is suppressed by the soft start circuit through clamping the pulse width and output voltage.
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Phase Setting and Converter Start Up The TDA21302 interfaces with companion MOSFET drivers, TDA21106 ( Single Channel ) and TDA21102 ( Dual Channel ), for correct converter initialization. The tri-state PWM output pins sense the interface voltage at IC POR period ( both VCC and DVD trip ). The channel is enabled if the voltage at the pin is 1,2V less than VCC. Please tie the PWM outputs to VCC and the current sense pins to GND or leave them floating if the channel is unused. For 3 Phase application, connect PWM4 high. Current Sensing Setting TDA21302 senses the current of the Sync FET in each phase when it is conducting for channel balance and droop tuning. The differential sensing GM amplifier converts the voltage on the sense components which can be sense resistors or the Rds(on) of the Sync FET to current signal into internal balance circuit.
IX1 Current Balance Droop OCP IX1 2IX1 IX1 IBP
Sample & Hold
GM Amplifier IBP Differential Current
ISP1 ISN1
RSP1
IL1
RSN1 RDS(on)1
Basic Theory
V + = IBP x RSN1
,
V - = (IBP+IX1) x RSP1 - IL1_VALLEY x RDS(on)1 IX1 = IL1_VALLEY x RDS(on)1 RSP1
V + = V - and RSN1 = RSP1
IPEAK IAVG
I= VO x TOFF L
I Ivalley
The sensing circuit gets IX= Therefore,
IL x RS by local feedback. RSP = RSN to cancel the voltage drop caused by RSP GM amplifier input bias current. IX is sampled and held just before low side MOSFET turns off.
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IL (S/H) x RS VO x TOFF VIN - VO , IL (S/H)=IL (AVG) , TOFF = x 3,3uS for FOSC = 300 KHz RSP 2L VIN VIN - VO VO x x 3,3uS RS VIN x IX (S/H)= IL (AVG) RSP 2L IX (S/H)=
DAC Offset Voltage & Droop Setting
1V Rf1 x The DAC offset voltage is set by compensation network & external resistor at VOSS pin by RVOSS. 4
The S/H current signals from power channel are injected to ADJ pin to establish the droop voltage. VADJ = RADJ X 2IX. The DAC output voltage decreased by VADJ to generate the VCORE load droop.
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DS-CoreControl-TDA21302
Protection and SS Function
For OVP, the TDA21302 detects the VCORE by VDIF pin voltage that is the output of the differential amplifier. This is to eliminate the delay caused by the compensation network for faster and more accurate detection. The trip point of OVP is 140% of the normal VCORE voltage level. The PWM outputs are pulled low to turn on the Sync FET and to turn off the control FET while OVP is detected. The OVP latch can only be reset by either VCC or DVD. The PGOOD trip point is set at the 92% of the normal VCORE voltage level. The open drain PGOOD pin shall be pulled low while VCORE is lower than this point. During the VID on the fly condition, there is nothing able to change the status of the PGOOD. Soft-start circuit generates a ramp by charging an external capacitor with a 13uA constant current source after the POR of IC is active. The pulse width of PWM signal and VCORE are clamped by rising ramp to reduce the inrush current and protect the power devices. Over-current protection trip point is internally set at around 100uA for each channel. OCP is triggered if one channel S/H current signal. Controller forces PWM output latched at high impedance to turn off both control and Sync FETs in the power stage and initial the hiccup mode protection. The SS pin voltage is pulled low with a 13uA current after it is less than 90% VCC. The converter restarts after SS pin voltage is lower than 0,2V. Three times of OCP disable the converter and only release the latch by POR acts.
CH1 : VADJ
CH2 : Short Circuit Current
CH3 : VCORE
CH4 : VSS
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Design Process Suggestion :
Voltage Loop Setting * * *
Pole and Zero of output filter : Output inductor value, the capacitance and ESR value of the output capacitors Compensation Network : Error amplifier compensation & sawtooth wave amplitude. Kelvin sense for VCORE
Current Loop Setting * *
GM amplifier S/H current setting : Current sensing components ( Rds(on) ), the value of the resistors connecting to ISPx & ISNx. Do keep ISPx current < 60uA at full load condition for better load line linearity. Over current protection trip point : This has been set internally and please keep ISPx < 100uA at OCP condition for better accuracy.
VRM Load Line Setting * * *
Droop amplitude : External ADJ pin resistor. No load offset : Additional resistor in compensation network. DAC offset voltage seeting : VOSS pin & compensation network resistor.
PCB Layout * *
Kelvin sense for current sense GM amplifier input. Refer to layout guide for other item.
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Design Example :
Given
Apply for four phase converter VIN = 12V VCORE = 1,35V ILOAD = 100A VDROOP = 100 mV at full load OCP set at 35A for each channel ( S/H ) Rds(on) = 3 m for Sync FET at 25C ( 2 X IPU06N03LA in parallel ) LOUT = 0,6uH COUT = 17,600 uH with 1 m ESR
1. Compensation Setting * Modulator Gain, Pole and Zero :
From the following formula ; Modulator Gain =
VIN = VRAMP
12V 3 1,9V x 2
= 4,2 ( 12,46 dB )
Where VRAMP : ramp amplitude of the sawtooth waveform
LC Filter Pole =
1 2 x LC
= 1,549 KHz and
ESR Zero =
1 = 9,0429 KHz 2 x ESR x COUT
*
EA Compensation Network :
Select RF1 = 2,4 K , RF2 = 24 K , CC2 = 6,6 nF, CC1 = 33 pF and Use type 2 compensation scheme shown in Figure 5.
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VDAC
Error Amplifier
RF2+(1/SCC2)
RF1 VDIF RF2 FB CC1 CC2 COMP
1 ) CC2RF2 RZ = CC1 + CC2 SCC1(S + ) RF2CC1CC2 (S +
From the following formulas :
FZ =
1 = 1 KHz , FP = 2 x RF2 x CC1
1 CC1 x CC2 = 200 KHz 2 x RF2 x CC1+CC2
RF2 Middle Band Gain = RF1 = 10 ( 20 dB )
The asymptotic bode plot of EA compensation and PWM loop gain is shown as below.
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2. Droop & DAC Offset Setting
For each channel the load current is 100A / 4 = 25A and the ripple current, IL , is given as
3,33uS x 1,35V 1,35V x 1- 0,6uH 12V = 6,65 A
I The load current, IL, at S/H is 25A - 2 = 21,675 A.
Using the following formula to select the appropriate IX(MAX) for the S/H of GM amplifier :
IX(MAX)
=
RDS(ON) x 21,675A RSP
The suggested IX is in the range of 50 uA 5uA, select RSP = RSN = 1,5 K, then IX(MAX) would be 43,35 uA. VDROOP = 100 mV = 43,35 uA X 2 X 4 X RADJ, therefore RADJ = 287 . The RDS(ON) of MOSFET varies with temperature rise. When the Sync FETs are working at 100C junction temperature, the RDS(ON) of MOSFET at 100C is given as 7,3 m. So the RADJ at 100C is given as : RADJ_100C X ( RDS(ON)_25C / RDS(ON)_100C ) = 236
3. Over Current Protection Setting
OCP trip point is internally set at around 100 uA of IX for each channel. As above selected RSP = RSN = 1,5 K, the OCP trip point is found using :
Ix(OCP) = RDS(ON) x IL(TRIP) 3m x IL(TRIP) = = 100uA RSP 1,5K
4. Soft-start Capacitor Selection
CSS = 100 nF is the suitable value for most application.
ISS x tSS VSS ISS = 13 uA , VSS = 2V , tSS = 10 mS CSS = 65 nF ISS x tSS = VSS x CSS CSS =
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Layout Guide :
Place the high-power switching components first, and separate them from the sensitive nodes.
1. Most Critical Path :
The current sense circuit is the most sensitive part of the converter. The current sense resistor tied to ISP1,2,3,4 and ISN1,2,3,4 should be located not more than 0,5 inch from the IC and away from the noise switching nodes. The PCB trace of sense nodes should be parallel and as short as possible. Kelvin connection of the sense component, additional current sense resistor or the RDS(ON) of MOSFETs, ensures the accurate and stable current sensing signals.
DPAK or D2PAK
IPAK
2. Switching Ripple Path :
* * * * * *
The best connection of the input capacitors is to place at the drain of the high side MOSFET and the source of the low side MOSFET. Low side MOSFET to the output capacitor. The return path of input and output capacitor. Separate the power and signal GND. The PHASE node, the conjunction of the high / low side MOSFETs and inductor, is the nosiy node. Keep them away from the sensitive small-signal node. Reducing the parasitic impedance and inductance is done by minimizing the length of the traces, offering enough copper area and avoiding the vias. Page 21 of 25 DS-CoreControl-TDA21302
CoreControl TM
3. MOSFET drivers :
* * * * *
Both of the decoupling capacitors for VCC and PVCC should be placed as close to the driver IC as possible. The bootstrap capacitor should be placed close to the BOOT pin. The traces of GATEHS and PHASE should be routed in parallel and to keep it short and wide. The width of the trances should be no less than 40mils. High current loops from the input capacitor, high side MOSFET, output inductors and output capacitors back to the input capacitor negative terminal should be kept the distance minimized. The conjunction of high side MOSFET, low side MOSFET and output inductor should be kept as close as possible.
4. Other Path :
* *
The components from the compensation network, high frequency bypass capacitors and the setting resistors should be placed near controller IC and away from the noisy power path. The thermal compensation thermistor should be placed at the hottest point which is normally the MOSFETs located at the inner part of the power stage.
CoreControl TM
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Outline Dimension :
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DS-CoreControl-TDA21302
Revision History Datasheet DS-CoreControl-TDA21302
Actual Release: V1.2 Date: 10.04.2004 Page of actual Rel. 17 10 Page of prev. Rel. 17 10
Previous Release: V1.1
Date: 10.01.04
Subjects changed since last release
CC1 = 6,6 nF, CC2 = 33 pF => CC2 = 6,6 nF, CC1 = 33 pF VID table correction VID4 1 0 from 1,0375V to 1,0875v
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see the address list on the last page or our webpage at
http://www.infineon.com/DCDC
OptiMOS and OptiMOS II are trademarks of Infineon Technologies AG.
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Edition 2004-01-10
Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen
(c) Infineon Technologies AG 2004.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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Infineon Technologies Asia Pacific,Pte.Ltd. 168 Kallang Way Singapore 349 253 T (+65)8 40 06 10 Fax (+65)7 42 62 39
USA
Siemens Ltda. Semiconductores Avenida Mutinga,3800-Pirituba 05110-901 Sao Paulo-SP T (+55)11-39 08 25 64 Fax (+55)11-39 08 27 28
CDN
Infineon Technologies Siemens House Oldbury GB-Bracknell,Berkshire RG12 8FZ T (+44)13 44-39 66 18 Fax (+44)13 44-39 66 32
H
Infineon Technologies Corporation 320 March Road,Suite 604 Canada,Ontario K2K 2E2 T (+1)6 13-5 91 63 86 Fax (+1)6 13-5 91 63 89
CH
Simacomp Kft. Lajos u.103 H-1036 Budapest T (+36)1-4 57 16 90 Fax (+36)1-4 57 16 92
HK
Siemens Components Scandinavia Ostre Aker vei 24 Postboks 10,Veitvet N-0518 Oslo T (+47)22-63 30 00 Fax (+47)22-68 49 13 Email: scs@components.siemens.se
NL
Siemens Schweiz AG Bauelemente Freilagerstrasse 40 CH-8047 Zurich T (+41)1-4 953065 Fax (+41)1-4 955050
D
Infineon Technologies Hong Kong Ltd. Suite 302,Level 3, Festival Walk, 80 Tat Chee Avenue, Yam Yat Tsuen, Kowloon Tong Hong Kong T (+8 52)28 32 05 00 Fax (+8 52)28 27 97 62
I
Siemens Electronic Components Benelux Postbus 16068 NL-2500 BB Den Haag T (+31)70-3 33 20 65 Fax (+31)70-3 33 28 15 Email:components@siemens.nl
NZ
Infineon Technologies Corporation 1730 North First Street San Jose,CA 95112 T (+1)4 08-5 01 60 00 Fax (+1)4 08-5 01 24 24 Siemens Components,Inc. Optoelectronics Division 19000 Homestead Road Cupertino,CA 95014 T (+1)4 08-2 57 79 10 Fax (+1)4 08-7 25 34 39 Siemens Components,Inc. Special Products Division 186 Wood Avenue South Iselin,NJ 08830-2770 T (+1)7 32-9 06 43 00 Fax (+1)7 32-6 32 28 30
VRC
Siemens Auckland 300 Great South Road Greenland Auckland T (+64)9-5 20 30 33 Fax (+64)9-5 20 15 56
P
Infineon Technologies AG Volklinger Str.2 D-40219 Dusseldorf T (+49)2 11-3 99 29 30 Fax (+49)2 11-3 99 14 81 Infineon Technologies AG Werner-von-Siemens-Platz 1 D-30880 Laatzen (Hannover) T (+49)5 11-8 77 22 22 Fax (+49)5 11-8 77 15 20 Infineon Technologies AG Von-der-Tann-Strae 30 D-90439 Nurnberg T (+49)9 11-6 54 76 99 Fax (+49)9 11-6 54 76 24 Infineon Technologies AG Weissacher Strae 11 D-70499 Stuttgart T (+49)7 11-1 37 33 14 Fax (+49)7 11-1 37 24 48
D
Siemens S..A. Semiconductor Sales Via Piero e Alberto Pirelli,10 I-20126 Milano T (+39)02-66 76 -1 Fax (+39)02-66 76 43 95
IND
Infineon Technologies AG Halbleiter Distribution Richard-Strauss-Strae 76 D-81679 Munchen T (+49)89-92 21 40 86 Fax (+49)89-92 21 20 71
DK
Siemens Ltd. Components Division No.84 Keonics Electronic City Hosur Road Bangalore 561 229 T (+91)80-8 52 11 22 Fax (+91)80-8 52 11 80 Siemens Ltd. CMP Div,5th Floor 4A Ring Road,IP Estate New Delhi 110 002 T (+91)11-3 31 99 12 Fax (+91)11-3 31 96 04 Siemens Ltd. CMP Div,4th Floor 130,Pandurang Budhkar Marg, Worli Mumbai 400 018 T (+91)22-4 96 21 99 Fax (+91)22-4 96 22 01
IRL
Siemens S.A. an Componentes Electronicos R.Irmaos Siemens,1 Alfragide P-2720-093 Amadora T (+351)1-4 17 85 90 Fax (+351)1-4 17 80 83
PK
Siemens Pakistan Engineering Co.Ltd. PO Box 1129,Islamabad 44000 23 West Jinnah Ave Islamabad T (+92)51-21 22 00 Fax (+92)51-21 16 10
PL
Siemens SP.z.o.o. ul.Zupnicza 11 PL-03-821 Warszawa T (+48)22-8 70 91 50 Fax (+48)22-8 70 91 59
ROK
Siemens A/S Borupvang 3 DK-2750 Ballerup T (+45)44 77-44 77 Fax (+45)44 77-40 17
E
Siemens Ltd. Electronic Components Division 8,Raglan Road IRL-Dublin 4 T (+3 53)1-2 16 23 42 Fax (+3 53)1-2 16 23 49
IL
Siemens Ltd. Asia Tower,10th Floor 726 Yeoksam-dong,Kang-nam Ku CPO Box 3001 Seoul 135-080 T (+82)2-5 27 77 00 Fax (+82)2-5 27 77 79
RUS
Infineon Technologies Hong Kong Ltd. Beijing Office Room 2106,Building A Vantone New World Plaza No.2 Fu Cheng Men Wai Da Jie Jie 100037 Beijing T (+86)10 -68 57 90 -06,-07 Fax (+86)10 -68 57 90 08 Infineon Technologies Hong Kong Ltd. Chengdu Office Room14J1,Jinyang Mansion 58 Tidu Street Chengdu, Sichuan Province 610 016 T (+86)28-6 61 54 46 /79 51 Fax (+86)28 -6 61 01 59 Infineon Technologies Hong Kong Ltd. Shanghai Office Room1101,Lucky Target Square No.500 Chengdu Road North Shanghai 200003 T (+86)21-63 6126 18 /19 Fax (+86)21-63 61 11 67 Infineon Technologies Hong Kong Ltd. Shenzhen Office Room 1502,Block A Tian An International Building Renim South Road Shenzhen 518 005 T (+86)7 55 -2 28 91 04 Fax (+86)7 55-2 28 02 17
ZA
INTECH electronics ul.Smolnaya,24/1203 RUS-125 445 Moskva T (+7)0 95 -4 51 97 37 Fax (+7)0 95 -4 51 86 08
S
Siemens S.A. Dpto.Componentes Ronda de Europa,5 E-28760 Tres Cantos-Madrid T (+34)91-5 14 71 51 Fax (+34)91-5 14 70 13
Nisko Ltd. 2A,Habarzel St. P.O.Box 58151 61580 Tel Aviv -Isreal T (+9 72)3 -7 65 73 00 Fax (+9 72)3 -7 65 73 33
Siemens Components Scandinavia Osterogatan 1,Box 46 S-164 93 Kista T (+46)8-7 03 35 00 Fax (+46)8-7 03 35 01 Email: scs@components.siemens.se
Siemens Ltd. Components Division P.O.B.3438 Halfway House 1685 T (+27)11-6 52 -27 02 Fax (+27)11-6 52 20 42
CoreControl TM
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